BondaScope 3100

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BondaScope 3100

Full featured multi-mode handheld bond tester featuring Pitch-Catch, Resonance Impedance Plane Mode and an adjustable high energy Fixed Frequency MIA Mode (Mechanical Impedance Analysis) as well as a Swept Frequency MIA Mode.
Perfect to measure the level of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bondline thickness variations, impact damage assessment etc.
Typical applications:
  • Multi-Layered Laminates
  • Graphite-Resin Composites
  • Boron Fiber Composites
  • Kevlar Composites
  • Glass Fiber Composites
  • Composite-to-Substrate
  • Composite-to-Composite
  • Honeycomb Structures
  • Skin-to-Honeycomb
  • Honeycomb-to-Honeycomb
  • Impact Damage
  • Rub Strip

Bond-3100

BondaScope 3100 bond tester (Pitch & Catch, Resonance and MIA), including lithion-ion battery, 110/220VAC universal charger, USB cable and software

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